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(¿ë·®: 100g)
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- Reflow ÀÜ»ç´Â ¸¼°í ¹«»öÀ̸ç ATE ȣȯ¼º¿¡ ½±°Ô µû¸£±â¿¡ ÃæºÐÇÑ Åõ°ú¼ºÀÌ ÀÖ½À´Ï´Ù.
- ÀÌ BGA/CSP Flux´Â IC package bumping ¶Ç´Â repair ÀÛ¾÷¿¡¼ solder sphere¸¦
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Color & Specific gravity |
Light Amber,1.0g/cc |
Viscosity |
Typical value of 180 POISE@ 30 rpm |
Tack Strength |
6 grams/mm©÷ |
Stencil Life |
~8 hours |
Reflowed Residue |
Tack free |
Corrosivity |
PassesCopper Mirror |
review ¸®½ºÆ®
NO |
SUBJECT |
SCORE |
NAME |
DATE |
REVIEW
review ¸®½ºÆ®
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Q&A
QnA ¸®½ºÆ®
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